PT100MF0MPx
■ Design Considerations
Design Guidelines
1. This product is not designed to be electromagnetic- and ionized-particle-radiation resistant.
■ Manufacturing Guidelines
Soldering Instructions
1. Sharp recommends soldering no more than once when using solder reflow methods.
2. When using solder reflow methods, follow the Reflow Soldering Temperature Profile shown in Fig. 10. Sharp
recommends checking the process to make sure these parameters are not exceeded; exceeding these param-
eters can cause substrate bending or other mechanical stresses leading to debonding of the internal gold wires,
or other similar failure modes.
3. If using an infrared lamp to preheat the parts, such heat sources may cause localized high temperatures in the
part's resin. Be sure to keep the temperature profile within the guidelines shown in Fig. 10.
4. If hand soldering, use temperatures ≤ 260° for ≤ 3 seconds. Do not dip-solder or VPS-solder this part.
5. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or
defects in plated connections. Internal connections may be severed due to mechanical force placed on the pack-
age due to the PCB flexing during the soldering process.
Fig. 10 Reflow Soldering Temperature Profile
240°C MAX.
200°C
1 ~ 4°C/s
165°C MAX.
1 ~ 4°C/s
1 ~ 4°C/s
25°C
10 s MAX.
60 s MAX.
120 s MAX.
90 s MAX.
Cleaning Instructions
1. Confirm this device's resistance to process chemicals before use, as certain process chemicals may affect the
optical characteristics.
2. Solvent cleaning: Solvent temperature should be 45°C or below. Immersion time should be 3 minutes or less.
3. Ultrasonic cleaning: The effect upon devices varies due to cleaning bath size, ultrasonic power output, cleaning
time, PCB size and device mounting circumstances. Sharp recommends testing using actual production condi-
tions to confirm the harmlessness of the ultrasonic cleaning methods.
4. Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol.
Sheet No.: D1-A01801EN
6
相关PDF资料
PT100MF1MP1 PHOTOTRANS DARL OUT CLEAR SMD
PT103G2 THERMISTOR 10K OHM +/-0.20C
PT103J2 THERMISTOR 10K OHM +/-0.20 C
PT104J2 THERMISTOR 100K OHM +/-0.20 C
PT11-21C/L41/TR8 PHOTOTRANSISTOR CLEAR MINI 1206
PT12-21B/TR8 PHOTOTRANSISTOR BK RA MINI SMD
PT12-21C/TR8 PHOTOTRANSISTOR WATER CLR RA SMD
PT15-21B/TR8 PHOTOTRANSISTOR FLAT TOP BK 1206
相关代理商/技术参数
PT100MF1MP 制造商:未知厂家 制造商全称:未知厂家 功能描述:PHOTOTRANSISTOR
PT100MF1MP1 功能描述:光电晶体管 Darlington output Ver of PT100MF0MP1 RoHS:否 制造商:OSRAM Opto Semiconductors 最大功率耗散:165 mW 最大暗电流:200 nA 封装 / 箱体:T-1
PT100P01 制造商:Seiko Instruments Inc (SII) 功能描述:
PT100PG 制造商:Hammond Manufacturing 功能描述:
PT100PSIG-13-LI3-H1131 制造商:TURCK Inc 功能描述:Sensor, Pressure Transmitter, Scaled In Bar, 0-100 bar (0-1450 psi), H6831459
PT100PSIG-13-LI3-H1131/S1604 制造商:TURCK Inc 功能描述:PT100PSIG-13-LI3-H1131/S1604
PT100R-1000 功能描述:固定电感器 100uH 15% .08ohm VrtMnt Toroid Radial RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm
PT100R-1000HM 功能描述:固定电感器 100uH 15% .08ohm HznMnt Toroid PwrInd RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm